ICCSEEA2023: The 6th International Conference on Computer Science, Engineering and Education Applications
March 17 - March 19 , 2023 , Warsaw, Poland
The 6th International Conference on Computer Science, Engineering and Education Applications (ICCSEEA2023) - Virtual Conference
March 17–19, 2023
Warsaw, Poland
The 6th International Conference on Computer Science, Engineering and Education Applications (ICCSEEA2023) will be held on March 17–19, 2023, in Warsaw, Poland. The ICCSEEA2023 will bring together the top researchers from the Asian Pacific Nations, North America, Europe, and around the world to exchange their research results and address open issues in computer science, engineering, and education applications. The organization of such a conference is one of the examples of growing Ukraine-Poland cooperation in different fields of science and education. The official conference language is English. All the papers need to be written and presented in English.
~^o^~ Please click here to submit your paper. ~^o^~
💖 The conference book has been published online by Springer Publisher. ( 2023-08-18)
💖 Conferece Program. ( 2023-03-15)
💖 Call for paper. (2022-7-27)
💖 The Book of ICCSEEA2022 has been published online by Springer. (2022-5-4)
Publication Information
ICCSEEA2023 will be published by "Lecture Notes on Data Engineering and Communications Technologies" (Pending), and all accepted papers will be indexed in some international major academic databases(Scopus, Ei Compendex, Google Scholar and etc.).
Authors are invited to submit original unpublished manuscripts that demonstrate recent advances in the following areas of interest, but are not limited to:
Area 1:Computer Science and Software Engineering
Big Data and Database Technologies
Data Mining and Knowledge Recovery
Knowledge Management and Knowledge Engineering
Evolutionary Computing and Genetic Algorithms
Neural Networks
Bayesian Networks
Fuzzy Systems, Soft Computing and Fuzzy Control
Formal Methods and Tools
Programming Languages
Software Modelling
Business Process Reengineering
Engineering of Embedded and Real-time Software
Reengineering, Reverse Engineering
Engineering Secure Software
Trusted Computing
Safety and Security Critical Software
Information Security and Privacy Protection
Ubiquitous Computing
Internet of Things and Web of Things
Image and Signal Processing
Data Acquisition, Normalization, Analysis and Visualization
Algorithms, Models, Software, and Tools in Bioinformatics
Biomedical Imaging, Image Processing and Visualization
Multimedia Technologies
Augmented and Virtual Reality
Human-Computer Interaction
Distributed Computer Systems
Smart Logistics and Supply Chain
Computer Systems and Networks
Parallel and Distributed Computing
Information Technology and Information Systems
Area 2:Engineering
Robotic Systems and Technologies
Intelligent Mechatronics and Robotics
Process Automation
Intelligent Automation
System Theory and Control Theory
Nonlinear Systems and Control
Industrial Electronics
Logistics Engineering
Electronics Engineering
Bioelectrical and Neural Engineering
Biomaterials and Biomedical Optics
Biomedical Devices, Sensors, and Artificial Organs
Biomedical Robotics and Mechanics
Rehabilitation Engineering and Clinical Engineering
Health Monitoring Systems and Wearable System
Bio-signal Processing and Analysis
Biometric and Bio-measurement
Electrical Engineering and Smart Grids
Area 3:Education
Knowledge Management in e-Learning
Research Perspectives for e-Learning
Virtual and Distance Education
Online Learning Environments
Logistics Talent Training
Collaborative Approaches and Technologies
Learning and Content Management Systems
Big Data in Education and Learning Analytics
Mobile Teaching and Learning Technologies
Educational Games and Simulations
Virtual Reality Learning Environment
Augmented Reality in Education
Educational Multimedia
Emerging Technologies for Learning and Teaching
Open Education
Networked Learning
Instructional Design and Technology
Formal and Informal Learning Research
Paper Submission Deadline: December 30, 2022 Extended to February 16, 2023
Notification Date: February 24, 2023
Authors' Registration: February 27, 2023
Camera Ready: February 26, 2023
Conference Dates: March 17–19, 2023
Chairs
Prof., IEEE Fellow, Felix Yanovsky, Delft University of Technology, Delft, Netherlands
Prof. Ivan Dychka, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. Anatoliy Sachenko, Kazimierz Pułaski University of Technology and Humanities in Radom, Poland
General Co-Chairs
Prof. Matthew He, Nova Southeastern University, Florida, USA
Prof. Yuriy Ushenko, Chernivtsi National University, Chernivtsi, Ukraine
Prof. Roman Kochan, University of Bielsko-Biała, Bielsko-Biala, Poland
Prof. Oleksandr Pavlov, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. Q.Y. Zhang, Wuhan University of Technology, China
International Program Committee
Dr. Oleksii K. Tyshchenko, University of Ostrava, Czech Republic
Dr. Essa Alghannam, Tishreen University, Syria
Dr. Rabah Shboul, Al-albayt University, Jordan
Dr. L.J. Du, Wuhan University of Technology, China
Prof. Krzysztof Kulpa, Warsaw University of Technology, Warsaw, Poland
Prof. M.Y. Zhang, Wuhan University of Technology, China
Prof. M. Wang, Wuhan Technology and Business University, China
Prof. Ihor Tereikovskyi, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. G.E. Zhang, Nanning University, China
Prof. Q.L. Zhou, Shizuoka University, Japan
Prof. E. Fimmel, Mannheim University of Applied Sciences, Germany
Prof. G. Darvas, Institute Symmetron, Hungary
Prof. Z.P. Liu, Wuhan University of Technology, China
Prof. Jacek Misiurewicz, Warsaw University of Technology, Warsaw, Poland
Dr. X.J. Ma, Huazhong Universiy of Science and Technology, China
Prof. S.C. Qu, Central China Normal University, China
Prof. Y. Shi, Bloomsburg University of Pennsylvania, USA
Prof. Y.C. Zhang, Business School of Hubei University, China
Dr. Feng Liu, Huazhong Agricultural University, China
Prof. Sergey Petoukhov, MERI RAS, Moscow, Russia
Prof. Z.W. Ye, Hubei University of Technology, China
Prof. J.S. Dai, National University of Singapore, Singapore
Prof. C.C. Zhang, Fengchia University, Taiwan
Dr. Andriy Gizun, National Aviation University, Kyiv, Ukraine
Prof. Yevhen Yashchyshyn, Warsaw University of Technology, Warsaw, Poland
Prof. Vitaly Deibuk, Chernivtsi National University, Chernivtsi, Ukraine
Dr. J. Su, Hubei University of Technology, China
Prof. H.F. Yang, Waseda University, Japan
Dr. G.K. Tolokonnikova, FNAT VIM of RAS, Moscow, Russia
Steering Chairs
Prof. Vadym Mukhin, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Dr. Solomiia Fedushko, Lviv Polytechnic National University, Lviv, Ukraine
Dr. Sergiy Gnatyuk, National Aviation University, Kyiv, Ukraine
Prof. Yevgeniya Sulema, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Local Organizing Committee
Prof. Krzysztof Przystupa, Lublin University of Technology, Poland
Dr. Jacek Kucharski, Lodz University of Technology, Poland
Dr. Rafal Stanisławski, Opole University of Technology, Poland
Dr. Anna Szlachta, Politechnika Rzeszowska, Poland
Prof. Arkadiusz Jan Tofil, Lublin University of Technology, Poland
Dr. Joanna Michalowska, The University College of Applied Sciences in Chełm, Poland
Dr. Joanna Koziel, Lublin University of Technology, Poland
Dr. Ivan Izonin, Lviv Polytechnic National University, Lviv, Ukraine
Dr. Vladimir Simov Jotsov, University of Library Studies and Information Technologies, Sofia, Bulgaria
Prof. Orest Kochan, Lviv Polytechnic National University, Lviv, Ukraine
Dr. Andrii Petrashenko, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. Oleksandra Yeremenko, Kharkiv National University of Radio Electronics, Kharkiv, Ukraine
Dr. Roman Odarchenko, National Aviation University, Kyiv, Ukraine
Prof. Dmitriy Zelentsov, Ukrainian State University of Chemical Technology, Ukraine
Dr. Artem Volokyta, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Dr. Taras V. Panchenko, Kyiv National Taras Shevchenko University, Kyiv, Ukraine
Dr. Volodymyr Sokolov, Borys Grinchenko Kyiv University, Kyiv, Ukraine
Dr. Oleg Melnikov, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. Anatolii Pashko, Taras Shevchenko National University of Kyiv, Kyiv, Ukraine
Publication Chairs
Prof. Z.B. Hu, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prof. Matthew He, Nova Southeastern University, Florida, USA
Prof. Ivan Dychka, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Prospective authors are encouraged to submit a full paper for review by December 30, 2022, in Word or PDF format. Papers will be accepted based on peer review and should contain original, high-quality work. Claims and results should be substantive enough to be further developed as quality work. All papers must be written in English. The length of the standard paper submitted is 9–10 pages, including figures and references. An extra page fee will be paid for the number of pages exceeding 10 pages (Paper Word Templates, Conference Paper Example), including figures and references. All accepted papers will be presented in oral sessions or poster sessions.
Notice: If the authors have some problems during the paper submission, please contact us by e-mail: iccseea@icics.net.
Registration Fee
Registration | Registration Fee | Extra page |
Regular Authors | 500 USD | 50 USD |
Student Authors | 300 USD | 50 USD |
Attendees without papers | 200 USD | |
Keynote Speaker | free | |
Ukrainian Authors | free | |
ICICS Member | free |
Paper Acceptance Reward Program: Papers that are accepted for publication will be rewarded based on the review results of the organizing committee. The reward levels are divided into five categories: $300, $400, $500, $600, and $800. The reward amount will be used to offset the registration fee.