ISEM2022: The 2nd International Symposium on Engineering and Manufacturing
December 24 - December 25 , 2022 , Warsaw, Poland
The 2nd International Symposium on Engineering and Manufacturing(ISEM2022)-Online Conference
December 24–25, 2022
Warsaw,Poland
The 2nd International Symposium on Engineering and Manufacturing(ISEM2022) will be held in Warsaw, Poland on December 24–25, 2022. The aim of ISEM2022 is to provide a platform for researchers, engineers, academics, as well as industry professionals from all over the world to present their research results and development activities in the area of engineering and manufacturing and related fields. This conference provides opportunities for delegates to exchange new ideas and research findings in a face to face environment, to establish business or research relationships, and to find global partners for future collaboration. The official conference language is English, all the papers need to be written and presented in English.
~^o^~ Please click here to submit your paper.~^o^~
💖Call for Paper. ( 2022-06-24)
💖The conference book has been published online by Springer. ( 2022-05-10)
Publication Information
Accepted papers of ISEM2021 will be published by "Lecture Notes in Networks and Systems" - Springer(Pending), which is indexing in SCOPUS, INSPEC, WTI Frankfurt eG, zbMATH, SCImago.
Authors are invited to submit original unpublished manuscripts that demonstrate recent advances in the following areas of interest, but are not limited to:
Civil Engineering
Environmental Engineering
Materials Science and Engineering
Information Engineering
Management Engineering
Energy Engineering
Chemical Engineering
Mechanical Engineering
Agricultural Engineering
Bioinformatic Engineering
Electronic Engineering
Electrical Engineering
Nano Fabrication and Precision Engineering
Network Engineering
Software Engineering
Educational Technology
Multimedia Technology
Communications Technology
Geographic Information Engineering
Advanced Manufacturing Technology
Modern Design Theory and Technology
Manufacturing Processes and Technology
Manufacturing System and Simulation
Paper Submission: October 21, 2022
Notification Date: November 11, 2022
Authors' Registration: November 18, 2022
Conference Dates: December 24–25, 2022
Chairs
Prof. Felix Yanovsky, IEEE Life Fellow, Delft University of Technology, Netherlands
Prof. Anatoliy Sachenko, Kazimierz Pułaski University of Technology and Humanities in Radom, Poland
General Co-Chairs
Prof. Roman Kochan, University of Bielsko-Biała, Bielsko-Biala, Poland
Prof. Arkadiusz Jan Tofil, Politechnika Lubelska, Lublin, Poland
Prof. M. He, Nova Southeastern University, USA
Prof. Vadym Mukhin, National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Prof. Bo Wang, Wuhan University, China
International Program Committee
Prof. Janusz Kacprzyk, Systems Research Institute, Poland
Prof. Krzysztof Przystupa, Lublin University of Technology, Poland
Prof. Mykola Beshley, Lviv Polytechnic National University, Ukraine
Dr. Jacek Kucharski, Lodz University of Technology, Poland
Dr. Rafal Stanisławski, Opole University of Technology, Poland
Dr. Vladimir Simov Jotsov, University of Library Studies and Information Technologies, Sofia, Bulgaria
Dr. Anna Szlachta, Politechnika Rzeszowska, Rzeszow, Poland
Prof. Vitaly Deibuk, Chernivtsi National University, Chernivtsi, Ukraine.
Prof. X.D. Lai, Wuhan University, China
Dr. Oleksii K. Tyshchenko, University of Ostrava, Czech Republic
Prof. E. Fimmel, Institute of Mathematical Biology of the Mannheim University of Applied Sciences, Germany
Prof. A.U. Igamberdiev, Memorial University of Newfoundland, Canada
Dr. X.J. Ma, Huazhong Universiy of Science and Technology, China
Dr. L.D. Wang, Mississippi State University, USA.
Prof. S.C. Qu, Central China Normal University, China
Prof. Y. Shi, Bloomsburg University of Pennsylvania, USA
Dr. J. Su, Hubei University of Technology, China
Dr. H.R. Ma, Qinghai University, China
Prof. Maksim Iavich, Caucasus University, Georgia
Prof. Q. Wu, Harbin Institute of Technology, China
Prof. Yuriy Ushenko, Chernivtsi National University, Chernivtsi, Ukraine
Prof. Y. Wang, Wuhan University of Technology, China
Prof. Z.W. Ye, Hubei University of Technology, China
Dr. Ivan Izonin, Lviv Polytechnic National University, Lviv, Ukraine
Prof. Yevgeniya Sulema, National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Prof. Oleg Barabash, State University of Telecommunication, Kyiv, Ukraine
Prof. Dmitriy Zelentsov, Ukrainian State University of Chemical Technology, Ukraine
Dr. Artem Volokyta, National Techincal University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Prof. Viktor Vishnevskiy, State University of Telecommunication, Kyiv, Ukraine
Prof. Kyiv State Maritime Academy, Kyiv, Ukraine
Dr. Oleg Melnikov, National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Prof. Ihor Tereikovskyi, National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kyiv, Ukraine
Dr. Andrii Petrashenko, National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Dr. Volodymyr Sokolov, Borys Grinchenko Kyiv University, Kyiv, Ukraine
Steering Chairs
Dr. Joanna Koziel, Lublin University of Technology, Poland
Dr. Joanna Michalowska, State School of Higher Education, Poland
Dr. Sergiy Gnatyuk, National Aviation University, Kyiv, Ukraine
Prof. Oleksandra Yeremenko, Kharkiv National University of Radio Electronics, Kharkiv, Ukraine
Dr. Solomiia Fedushko, Lviv Polytechnic National University, Lviv, Ukraine
Prof. Orest Kochan, Lviv Polytechnic National Universitydisabled, Lviv, Ukraine
Publication Chairs
Prof. Felix Yanovsky, IEEE Life Fellow, Delft University of Technology, Netherlands
Prof. Z.B. Hu, National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
Prof. M. He, Nova Southeastern University, USA
Prospective authors are encouraged to submit a full paper for review by October 21, 2022, in Word or PDF format. Papers will be accepted based on peer review and should contain original, high-quality work. Claims and results should be substantive enough to be further developed as quality work. All papers must be written in English. The length of the standard paper submitted is 8–10 pages, including figures and references. An extra page fee will be paid for the number of pages exceeding 10 pages, while the maximum length is 15 pages(Paper Word Templates, Conference paper example), including figures and references. At the same time, authors with accepted papers should submit a signed Consent to Publish Form (PDF) to Springer. Helpful information for paper formatting can be found on the "Information for Authors of Springer Proceedings". All accepted papers will be presented in oral sessions or poster sessions.
Notice: If the author has some problems during the paper submission, please contact us by e-mail at [email protected].
Comming soon...
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Registration Fee
| Registration | Registration Fee | Extra page |
| Regular Authors | 200 USD | 50 USD |
| Student Authors | 100 USD | 50 USD |
| ICICS Member | free |
Warsaw
Warsaw, officially the Capital City of Warsaw, is the capital and largest city of Poland. The metropolis stands on the River Vistula in east-central Poland and its population is officially estimated at 1.8 million residents within a greater metropolitan area of 3.1 million residents, which makes Warsaw the 7th most populous capital city in the European Union. The city area measures 517 km2 (200 sq mi) and comprises 18 boroughs, while the metropolitan area covers 6,100 km2 (2,355 sq mi). Warsaw is an alpha global city, a major cultural, political and economic hub, and the country's seat of government. Its historical Old Town was designated a UNESCO World Heritage Site.
Lviv Polytechnic National University, Lviv, Ukraine
International Research Association of Modern Education and Computer Science, Hong Kong
National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Kyiv, Ukraine
National Aviation University, Kyiv, Ukraine
Hubei University of Technology, China
Polish Operational and Systems Society, Poland
MECS Publishing Group, Poland
We encourage all our industry and organization participants to consider becoming sponsors. Your company's sponsorship will provide your company with greater visibility to the conference delegates and highlight your standing in the ICICS community.
We are always happy to discuss your sponsorship requirements and tailor packs to suit your own needs. Email us at [email protected].
ISEM2021
ISEM2022
The Secretary of ISEM2022
Email: [email protected]